Computer readable medium for performing sensor array based materials characterization
US6668230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2002 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Dec 10, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC40B40/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular materials characterization apparatus includes a sensor array disposed on a substrate, with a standardized array and contact pad format; electronic test and measurement apparatus for sending electrical signals to and receiving electrical signals from the sensor array; an apparatus for making electrical contact to the sensors in the standardized array format; an apparatus for routing signals between one or more selected sensors and the electronic test and measurement apparatus and a computer including a computer readable having a computer program recorded therein for controlling the operator of the apparatus. The sensor array is preferably arranged in a standardized format used in combinatorial chemistry applications for rapid deposition of sample materials on the sensor array. The interconnection apparatus and sensor array and contact pad allow measurement of many different material properties by using substrates carrying different sensor types, with only minor modifications if any to the electronic test and measurement apparatus and test procedures. By using a sensor array that is separate from the electronic apparatus, and by including standardized contacting and signal …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.