Method of increasing tab bond strength using reactive ion etching
US6668445B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2000 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jan 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.