Arrangement for subjecting a bonding wire to a mechanical load
US6668667B2 · kind B2 · utility
3Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An arrangement in which a first contact surface (2) for bonding one end (51) of the bonding wire (5) and a piezoelectric actuator (3) are fixed on a support body (1) and a second contact surface (4) for bonding another end (52) of the bonding wire (5) is fixed to the actuator by an unsupported support body (34). The second contact surface moves back and forth in relation to the support body by means of an actuator, at a frequency of between 0.1 Hz and a few KHz and in one or more directions (31, 31′, 31″). The arrangement is suitable for use in testing the endurance of bonding wire connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.