Vehicle instrument panel structure to support electronics packaging
US6669273B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Sep 16, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60K37/20
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends across a substantial portion of the cockpit and defines a plurality of generally planar mounting sites and further defines at least one recess. At least one substrate is mounted to the beam and includes at least one area of the substrate populated by electronic components on both sides of the substrate. The area is aligned over the at least one recess, and an instrument panel cover is removably positioned over the substrate and the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.