Chuck means for flat workpieces, in particular semi-conductor wafers

US6669540B2 · kind B2 · utility

Assignee

• Peter Wolters CMP-Systeme GmbH & Co. KG · DE

Inventors

• Howe Gripp · Hanerau-Hademarschen, DE
• Paul Muller · Heidelberg, DE

Key dates

• Filing date: Mar 28, 2002
• Grant date: Dec 30, 2003
• Expiry date: Apr 12, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/30
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chuck means for flat workpieces, in particular semi-conductor wafer for the chemical-mechanical polishing, comprising a circular housing which is attached to a driving spindle for rotation therewith and has a top wall and an annular side wall, a retaining ring which forms the lower part of the side wall, a chuck plate of rigid, however elastically deformable material which has an upper and a lower side and a plurality of openings at the lower side as well which openings are in connection with radial and axial parallel passages in the chuck plate, the passages being in fluid connection with an axial passage in the spindle, the axial passage being connected to a vacuum and/or fluid source, the chuck plate being floatingly and vertically movably located in the housing, a plurality of pressure chambers above the chuck plate, the pressure chambers having lower wall portions which are yieldable and engage the upper side of the chuck plate, pressure manifold means which are connected with a fluid source under pressure and control the pressure in the individual pressure chambers, the lower chamber walls being in frictional engagement with the chuck plate for the transfer of torque from t…