Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide
US6669785B2 · kind B2 · utility
65Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | May 15, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of cleaning a microelectronic substrate is carried out by providing a cleaning fluid, the cleaning fluid comprising an adduct of hydrogen fluoride with a Lewis base in a carbon dioxide solvent; and then cleaning the substrate by contacting the substrate to the cleaning fluid for a time sufficient to clean the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.