Metal/ceramic composite molding material
US6669880B2 · kind B2 · utility
3Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jun 12, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.