Photocurable form-in-place gasket for electronic applications
US6670017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Dec 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.