Glass-silicon column
US6670024B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A glass-silicon column that can operate in temperature variations between room temperature and about 450° C. The glass-silicon column includes large area glass, such as a thin Corning 7740 boron-silicate glass bonded to a silicon wafer, with an electrode embedded in or mounted on glass of the column, and with a self alignment silicon post/glass hole structure. The glass/silicon components are bonded, for example be anodic bonding. In one embodiment, the column includes two outer layers of silicon each bonded to an inner layer of glass, with an electrode imbedded between the layers of glass, and with at least one self alignment hole and post arrangement. The electrode functions as a column heater, and one glass/silicon component is provided with a number of flow channels adjacent the bonded surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.