Hot melt adhesives based on polyamides
US6670442B1 · kind B1 · utility
6Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jun 21, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.