Patent · US Expired

Method and apparatus for removing substance from the surface of a workpiece

US6670575B1 · kind B1 · utility

23Cited by

8References

8Claims

0Family size

Assignee

LASERTEC CORPORATION · JP

Inventors

Peter Wrba · Unterthingau, DE
Peter Hildebrand · Pfronten, DE
Michael Kuhl · Hafenhofen, DE
Martin Reisacher · Kempten, DE

Key dates

Filing date	May 18, 2001
Grant date	Dec 30, 2003
Priority date	—
Expiry date	May 18, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/361
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of removing substance from the surface of a workpiece in which the removal of substance is effected layer-wise by irradiating a working site on the workpiece surface with a laser beam from a working head, the layer-wise removal of substance being carried out with the aid of a laser guidance guiding the laser across the surface of the workpiece within a working area predetermined by the apparatus, comprises positioning steps in which, after the start of the substance removal, the relative position of the workpiece and the working head are changed in accordance with a first and/or second criterion and adjusted so that a boundary of the working area comes to be disposed on different sections of the workpiece surface for identical working sites.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.