Laser shock peening method and apparatus
US6670577B2 · kind B2 · utility
8Cited by
11References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Oct 28, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/067
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for laser shock peening a surface is disclosed. A laser beam pulse from a laser apparatus is produced. The laser pulse has a cross-section taken perpendicular to the laser beam, a fluence profile across the cross-section. The pulse against an area on said surface. The fluence profile is controlled such that process induced defects are reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.