Integrated circuit chip
US6670707B2 · kind B2 · utility
2Cited by
13References
14Claims
0Family size
Inventor
Key dates
| Filing date | Feb 22, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip including a circuit board unit and a plurality of contact pads on a top surface of the unit. A die having a plurality of solder pads is positioned adjacent the circuit board unit with the solder pads wire-bonded to the contact pads. A lead frame having connecting leads is positioned on the circuit board unit with the leads connected to the solder pads via a conductive contact layer. A plastic layer encapsulates the circuit board unit and at least a portion with the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.