Micro relief element and preparation thereof
US6671095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2001 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Jun 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of preparing a composite micro relief element. The micro relief element comprises a first layer of a first substrate and a second layer of a relief forming polymer comprising an overlay and at least one relief feature portion. The method includes the steps of forming a line of contact between the receptive surface and at least one mold feature formed in a flexible dispensing layer, applying a quantity of resin to fill the mold feature along the line of contact. Moving the line of contact across the receptive surface whereby sufficient resin is captured by the mold feature and a quantity of resin passes the line of contact to form the overlay portion. The resin is then cured and the flexible dispensing layer is released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.