Patent · US Expired

Method for shock-resistant packaging of a product and a plane cardboard blank for carrying out the method

US6672035B1 · kind B1 · utility

6Cited by
13References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 17, 2001
Grant dateJan 6, 2004
Priority date
Expiry dateJul 17, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S206/813
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A product (18) is packed in a shock-resistant way in a box-shaped cardboard packing (20) by local application of an adhesive layer (16) on a base surface (17) of a plane cardboard blank, with which layer the product (18) is brought into contact and subsequently the cardboard packing (20) is completed by folding up the other elements of the plane blank (1) and closure of the packing. The plane cardboard blank may be made as a separate packing unit with adhesive layers in the form of adhesive tapes with an outward adhesive surface covered by a protective layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.