Method for repairing damaged areas in a metal component
US6672501B2 · kind B2 · utility
3Cited by
15References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Dec 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49318
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for repairing a superficial damaged area in a metal component formed as a result of a loss of material, whereby the damaged area is filled by way of a high-temperature soldering process. In order to improve the durability of the filling, an active solder is used during the high-temperature soldering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.