Method of bonding wires
US6672503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.