Slotted substrates and methods and systems for forming same
US6672712B1 · kind B1 · utility
19Cited by
22References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Nov 18, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.