Method and apparatus for forming pattern onto panel substrate
US6673386B2 · kind B2 · utility
9Cited by
9References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.