Moisture absorbing formed article
US6673436B2 · kind B2 · utility
9Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a material which can absorb moisture with ease and certainly, which exists in an equipment such as an electronic device. The invention relates to a moisture absorbing formed body comprising a hygroscopic agent and a resinous component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.