Method of manufacturing semiconductor device including semiconductor elements mounted on base plate
US6673651B2 · kind B2 · utility
31Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Jan 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device includes mounting a first semiconductor element on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.