Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution

US6674096B2 · kind B2 · utility

Assignee

• GELcore LLC · US

Inventor

• Mathew Sommers · Sagamore Hills, US

Key dates

• Filing date: Jun 8, 2001
• Grant date: Jan 6, 2004
• Expiry date: Jul 27, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815

Abstract

An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).