Method of producing high-frequency modules
US6675471B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49822
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub substrates 22, each the sub substrate 22 having an identical pattern of circuit developed thereon, and mounting electronic components on the sub substrate 22; a step 64 of, after the step 62, providing slits for electrically isolating signal terminals formed integrally; a laser trimming step 66 of, after the step 64, engaging pins 39 of an inspection tooling in direct contact with the signal terminals to conduct an inspection; and a separating step 72 of, after the step 66, separating the sub substrates 22 from the master substrate 21. Accordingly, the productivity for the high-frequency modules will be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.