Multiple temperature sensitive devices using two heat pipes
US6675887B2 · kind B2 · utility
9Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Jun 26, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.