Process for encapsulating an electrical or electronic component in a sealed manner
US6677187B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Feb 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate towards a periphery of the support. Also included is a protective and sealing casing attached to the support and hermetically sealed with respect to the latter by a peripheral metal bead. A main part of the casing is intended to be placed opposite the support which is provided with hollow conducting elements passing through the thickness of the casing. Electrically conducting metal tracks radiate from external upper ends of the elements towards the periphery of the casing and the internal lower end of the elements are connected to at least one electrical connection track provided on the support via a metal hybridization ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.