Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
US6677237B2 · kind B2 · utility
6Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.