Modified epoxy resin composition, production process for the same and solvent-free coating comprising the same
US6677426B2 · kind B2 · utility
64Cited by
1References
11Claims
0Family size
Assignee
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Key dates
| Filing date | May 14, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | May 14, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/62
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.