System and method for laser micro-machining
US6677552B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | May 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
System and method for laser micro-machining of crystalline and polycrystalline materials such as silicon that produces smooth surfaces. The invention is applied to integrated circuit applications including probing or modification of circuit components, electrical connections through silicon substrates, establishing ground plains within integrated circuits, and connections between circuits developed on opposing sides of a single substrate. Methods involve the use of femtosecond light pulses of short wavelength and circular polarization. A specific fluence region is used to obtain machined surfaces with smoothness to within one micron.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.