Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis
US6677664B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Apr 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is joined with pressure applied by the use of an anisotropic conductive film, an anisotropic conductive paste, a non-conductive resin paste, or a non-conductive resin film and the back of the integrated circuit chip is adhered to a metal chassis on a display panel by the use of an integrated-circuit chip adhesive. As a result, the metal chassis can be used as a radiator for the integrated circuit chip. Batch bonding will enable to shorten time for the connection process and to cut down the cost of installations. Furthermore, a radiator is unnecessary, resulting in a low-cost display driver module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.