Method of calibrating a wafer edge gripping end effector
US6678581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Mar 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of calibrating a wafer edge gripping end effector. A wafer calibration tool is held in a stationary position simulating the position of a semiconductor wafer to be picked up by the wafer edge gripping end effector. A controller associated with a robot having an end effector attached to a robot arm thereto is turned off. The robot arm and end effector are moved to position where the first and second clamp structures on the end effector each engage a respective inner edge that in part defines a notch formed in the wafer calibration tool. An actuator driven movable clamp structure is manually advanced so that the movable clamp structure engages an inner edge that in part defines one of the notches formed in the wafer calibration tool. The controller is turned on and data regarding the location of robot arm, end effector and movable clamp structure is stored.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.