Surface deformation of carrier for printhead dies
US6679581B2 · kind B2 · utility
0Cited by
12References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.