Polishing composition and polishing method employing it
US6679929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising the following components (a) to (g):(a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide,(b) an aliphatic carboxylic acid,(c) at least one basic compound selected from the group consisting of an ammonium salt, an alkali metal salt, an alkaline earth metal salt, an organic amine compound and a quaternary ammonium salt,(d) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine,(e) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole,(f) hydrogen peroxide, and(g) water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.