Method of electrodepositing copper
US6679983B2 · kind B2 · utility
10Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2001 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.