Compound for producing electrodes and process for forming electrodes
US6680008B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2000 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | May 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J11/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a novel compound of materials, which solves the problem of metal diffusion into glass layers during the formation of electrodes on a glass substrate. The invention provides a compound which comprises a powder of a conducting metal or alloy and a powder of a meltable metal or alloy. The use of a metal compound furthermore makes it possible to eliminate a firing step in the electrode formation process. Depending on various embodiments, the compound may furthermore include an adhesion promoter, in order to bond the electrodes to the substrate, a resin and/or a photosensitive substance. The invention also relates to a process for manufacturing a plasma panel using the said compound, and to a plasma panel obtained by the said process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.