Photosensitive resin composition
US6680152B2 · kind B2 · utility
1Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0212
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition (C) containing a photosensitive resin (B) which is a reaction product produced by modifying an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a modification product (A) and reacting the modification product (A) with a polybasic acid anhydride (c), and a compound (d) of the formula, in which each of n and m is an integer of at least 1, and a cured product of the photosensitive resin composition (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.