Electronic device and method of fabricating the same
US6680435B1 · kind B1 · utility
7Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2000 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Dec 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.