Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
US6680441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Jun 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.