Extruded heatsink and EMC enclosure
US6680849B2 · kind B2 · utility
12Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2002 |
| Grant date | Jan 20, 2004 |
| Priority date | — |
| Expiry date | Mar 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.