Molding apparatus for molding light emitting diode lamps
US6682331B1 · kind B1 · utility
72Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Sep 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method and system for molding light emitting diode (LED) lamps. A mold frame is provided around each LED chip in an array. A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip. The first mold insert is removed. A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.