Polishing pads and methods relating thereto
US6682402B1 · kind B1 · utility
36Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.