Seed repair and electroplating bath
US6682642B2 · kind B2 · utility
15Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2001 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Feb 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1089
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.