Memory expansion module with stacked memory packages and a serial storage unit
US6683372B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1999 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Nov 18, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.