Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6683787B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Jan 27, 2004 |
| Priority date | — |
| Expiry date | Mar 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.