Patent · US Expired

In-situ randomization and recording of wafer processing order at process tools

US6684125B2 · kind B2 · utility

8Cited by
6References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 30, 2001
Grant dateJan 27, 2004
Priority date
Expiry dateMay 21, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/137
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.