Molded imager optical package and miniaturized linear sensor-based code reading engines
US6685092B2 · kind B2 · utility
86Cited by
16References
15Claims
0Family size
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Key dates
| Filing date | Jun 15, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Dec 25, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K7/10722
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Molded imager optical packages are disclosed which are particularly adapted for use in miniaturized, linear sensor-based code reading engines. The package may include a one-dimensional solid state photo sensor with a small number of cells. A low F-number optical system may be integrally molded in the sensor packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.