Bookbinding method
US6685415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A bookbinding structure and method. The bookbinding structure is used to bind pages together in existing, commercially available binding machines. The bookbinding structure has a heat activated adhesive matrix for binding the pages. To attach a wrap-around book cover once the pages have been bound with the bookbinding structure, an adhesive on the outer surface of the bookbinding structure may be exposed by removing a release liner covering the adhesive. The book cover may then be adhered to the exposed adhesive either by a heat method or by applying pressure over the adhesive, depending on the particular type of adhesive of the bookbinding structure. The book cover may be printed with information and/or graphics prior to being wrapped around the pages of the book.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.