Method of fabricating patterned layers of material upon a substrate
US6686128B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Apr 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating patterned layers of a desired material in a desired, design pattern upon a substrate, which method may be used in circumstances where the removal of photo-resist material may not be used to lift-off undesired portions of the material from the substrate. The method uses copper or some other conducting material instead of the photo-resist material, Which copper or other conducting material may be removed by chemical processes to lift-off the undesired portions of material deposited upon the conducting material and substrate. The copper or other conducting material is fabricated upon the substrate so as to have a lip that overhangs and shadows the boundary of photo-resist material previously fabricated upon the substrate in the desired pattern. The photo-resist material is removed from the substrate and the desired material is deposited upon the substrate in a substantially directed manner such that the lip of conducting material prevents the deposition of a substantial amount of the desired material upon the edge of the copper or other conducting material. As a consequence, chemical means can then be used to remove the conducting material, thus undercutting a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.