Heat sink/heat spreader structures and methods of manufacture
US6686532B1 · kind B1 · utility
63Cited by
9References
27Claims
0Family size
Inventor
Key dates
| Filing date | Sep 18, 2000 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
Abstract
A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.