Atmospheric pressure inductive plasma apparatus
US6686558B2 · kind B2 · utility
8Cited by
10References
9Claims
0Family size
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Key dates
| Filing date | Jan 23, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | May 27, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K10/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An inductive plasma torch operating at atmospheric pressure is used for wafer or glass substrate processing. Said torch employs a linear type of plasma confinement. This linear torch is particularly suitable for photoresist etching and processes in which it has the advantages of high chemical isotropic etch rate and low plasma damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.