Solder pad structure for low temperature co-fired ceramic package and method for making the same
US6686665B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2002 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Sep 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/099
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for semiconductor devices, and methods for making the same are provided. The package includes a low temperature co-fired ceramic body that has a plurality of conductive interconnect layers. The low temperature co-fired ceramic body includes at least one solder ball attach side. A plurality of solder ball attach pads are defined on the solder ball attach side(s) of the low temperature co-fired ceramic body. Each of the solder ball attach pads is in contact with a conductive via that is in electrical communication with at least one of the plurality of conductive interconnect layers, and each solder ball attach pad has metallic content that is limited to silver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.